Top 3 Considerations and Cost Drivers when Selecting Hermetic Connectors By Nathan Foster, VP, HSG’s PA&E Division – About the author. The connector in a hermetic package may seem like minor consideration, but it is a key component that […]
Upcoming Events July 27, 2021 – HSG is excited to be back for in-person events! Come see us at CIOE 2021: Sept. 16-18 in Shenzhen, China Stay up-to-date before, during, and after each by using #HSGTradeshow on LinkedIn & Twitter.
Improve Quality & Reduce Manufacturing Costs with Solder Preforms The use of solder preforms can significantly simplify the effective attachment of components to an electronic package, reducing assembly time and subsequent costs while increasing reliability. Preforms are designed to deliver […]
TREVOSE, PA – January 5, 2021 – Hermetic Solutions Group (“HSG” or the “Company”), a global provider of highly engineered performance and protection solutions for mission-critical microelectronics, is pleased to announce that it has acquired Cristek Interconnects, Inc. (“Cristek”), a […]
If you have applications that must operate reliably at elevated temperatures and pressures, what are your specific temperature and pressure requirements? 10KPSI@ 150°C? 20KPSI@177°C? 25KPSI@200°C? 25KPSI@240°C? 30KPSI@260°C? Well, here at HSG, we have built and tested connectors that are reliable […]