Engineering Brief: DiaCool for High Density Power Applications

DiaCool for High Power Density Applications

Electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the “power density.” Higher power density […]

Hermetic Solutions Group Acquires FilConn

TREVOSE, PA – September 23, 2021 – Hermetic Solutions Group (“HSG” or the “Company”), a global provider of highly engineered performance and protection solutions for mission-critical microelectronics, is pleased to announce that it has acquired FilConn, an industry leading manufacturer […]