Qnnect can now provide our customers with DiaCool samples for heat spreader applications. Put the material through your evaluation criteria; we have quick turn DiaCool samples in various sizes, plated and ready to be shipped within a few days of ordering.
DiaCoolTM, a diamond-based composite from Hermetic Solutions Group, delivers a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity that can satisfy the most demanding high power density applications. DiaCool materials also exhibit excellent surface quality for die attach and soldering needs.
The material is easily adaptable to customer-specific designs. It’s a cost-effective solution to increase the long-term reliability of power, RF, laser diodes, or in any applications where thermal management is key to longevity.