Heat Dissipation Materials

The Hermetic Solutions Group has 100+ years of combined experience in metallurgy and the manufacture of metals and metal alloys.

To consistently meet evolving customer requirements and heat dissipation challenges, we use technically robust advanced thermal management materials. Additionally, we seek innovative new materials to help you be one step ahead of these challenges. The reference table shows the most common thermal management materials and we can help you identify the best thermal management solution for your specific application. 

We’re happy to assist in your design process and material selection - don’t hesitate to call us.

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Heatspreader Category Material Composition Coefficient of Thermal Expansion (ppm / K) Thermal Conductivity (W/(m*K)) Density
Room Temperature 100oC
Metals W 100% W 4.5 167 159 19.3
Mo 100% Mo 5.1 159 138 10.2
Cu 100% Cu 16.5 400 – 8.96
Metals, Composites, Alloys   Cu-W 90% W / 10% Cu 6.5 180 176 17
80% W / 20% Cu 8.3 200 197 15.65
75% W / 25% Cu 9.0 220 230 14.9
Cu – Mo 85% Mo / 15% Cu 7.0 160 156 10.01
70% Mo / 30% Cu 7.1 200 196 9.8
65% Mo / 35% Cu 9.4 210 205 9.7
Metal Laminates Cu-Mo-Cu 13% Cu / 74% Mo / 13% Cu 5.6 208 – 9.88
20% Cu / 60% Mo / 20% Cu 6.8 242 – 9.66
Ceramics AlN SALN-20 White 4.5 >200 >180 3.26
Ceramics – Metal Al-Si 60% Si / 40% Al 9.1 129 – 2.46
Al-SiC 70% SiC / 30% Al 8 140 – 2.6
Si-Sic 18% Si-SiC 3 >200 – 3
Diamond CVD-Diamond 2.3 >1000 – 3.52
Reference Data Semiconductor Si 3 151 – 2.3
GaAs 5.9 46 34 5.32
InP 4.5 70 – 4.79
GaN A5.6-c3.2 130 – 6.15
SiC 3.1 490 – 3.2
Ceramics Al2O2 6.7 17 17 3.6
BeO 7.6 251 180 2.9
Metals Cu 17 393 393 8.93
Al 23 238 – 2.7
Kovar 5.3 17 17 8.36
Organic FR-4 X15-y17 0.2 – –
Polyimide 25 0.2 – –