Thermal Management Solutions
With increasing power, speed and performance demands, dissipating heat in hermetically sealed devices that house sensitive electronic components is one of the biggest challenges in the microelectronics industry. At the Hermetic Solutions Group, we are experts in solving complex thermal management problems associated with microelectronic applications.
Proper material selection is fundamental to an efficient thermal management solution. We offer technically robust, advanced thermal management materials, such as molybdenum/copper (MoCu), copper/molybdenum copper (CMC), and tungsten/copper (WCu). We are also consistently looking for novel materials to support your evolving thermal management needs. Our thermal management products are EDM'd, milled or stamped to precise size and dimensions and then electroplated. Our products consistently exceed customer expectations for quality, workmanship standards (especially corners and edges), plating requirements and ease of use.
Three to five week lead times are typical; however, we also support the need for additional flexibility as required. We provide customers with certification of compliance and certification of analysis documentation and we manufacture with adherence to numerous industry standards - STM-B-488 (Gold), MIL-G-45204C (gold), ASTM –B-689 (electrolytic nickel), AMS-QQ-N-290 (electrolytic nickel), MIL-C-26074E (electroless nickel), and ASTM-B-733 (electroless nickel) J-Std-006.
DiaCoolTM for High Thermal Conductivity Applications
HSG's diamond composite materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials.
DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity that can satisfy the most demanding high power density applications. Our DiaCool materials exhibit excellent surface quality for all your die attach and soldering needs. DiaCool is easily adaptable to customer specific designs and is a cost-effective solution to increase the long-term reliability of power, RF, laser, and any applications where thermal management is vital to long term reliability.
Product highlights include:
- 600 – 850W/mK Thermal Conductivity (Thickness dependent)
- CTE 6-8 ppm
- Flexural Strength: 220 Strength: 220 ±10 MPa
- Test Materials available in various thicknesses. Please contact your Qnnect Representative for more information.
- DiaCool pairs well with any of our standard and custom Solder Preforms
- Thin Films and Electroless and Electrolytic plating chemistries available
For additional information on DiaCool, download the datasheet in our Resource Center.