Wire Bond Tabs

Wire bonding is a process for making a connection between a semiconductor and its packaging. The Hermetic Solutions Group offers extensive wire bond tab manufacturing capabilities.

Used as interconnect pads or bonding islands for gold and aluminum wire bond applications, wire bond tabs are a cost-effective and flexible technology used throughout the microelectronics industry. The most common metals used are Kovar and molybdenum due to their good electrical and high thermal conductivities and because their CTEs (Coefficient of Thermal Expansion) are between that of the silicon die and that of the ceramic substrate to which the tabs are attached. As experts in metal technologies, competitive lead times and high quality, Hermetic Solutions Group is absolutely the right partner for all of your wire bond tabs.

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