Lead frames reside inside a chip package and are the metal structures that carry signals from the die to the outside. The die inside the package is typically attached to the lead frame, and then bond wires attach the die pads to the leads.
Utilizing our vast experience in etched metals, suitable for a high- lead density, the Hermetic Solutions Group provides metal lead frames used in the manufacturing of hermetic microelectronic packages.
Typically made of Kovar, lead frames may or may not be plated when finished. They are manufactured with a chemical etching process and are generally attached to glass or ceramic.
With our decades of experience in supporting hermetic packaging performance, we are the perfect partner to help you identify the best solution for your application.