Evolving Solutions for Evolving Performance of Optical Networks
At the core of how Qnnect supports the optical networking communications market is our commitment to develop and support new designs, to provide rapid prototyping, often at significantly reduced tooling costs, and to ramp capability for high-volume production. We are an agile organization with a razor sharp focus on providing solutions for hard-to-resolve issues that may arise during and after system design. We leverage our vast experience in optoelectronics, as well as other microelectronics applications, to provide extremely high-quality, high-value products and service to our customers. There is no “end of the day” at Qnnect – we know that you are constantly designing for faster, more reliable performance and we are absolutely on-call to help you succeed.
Key Optical Networking Applications
DWDM Optical Transport Systems
Our Offerings in Optical Networking
The Hermetic Solutions Group manufactures high-reliability components to support a number of optical networking device applications, including:
- Digital attenuators
- Cellular communications
- DWDM (Dense Wavelength Division Multiplexing) optical transport systems
Key Benefits of Working with HSG
As transmission speeds increase beyond 100 Gb/s in both data centers and telecommunication applications, the need for complex, high reliability hermetic optoelectronic devices has never been stronger. Hermetic Solutions Group is uniquely positioned to help you maximize device reliability in any application.
Our Comprehensive Range of Solutions
Packaged electronic components in optical/telecommunications applications can often outgas moisture, oxygen and hydrogen and these contaminants can adversely impact the performance and reliability of a module. Getters from Qnnect absorb those materials, isolating them from the working electronics and help to ensure the long term viability of components.
Qnnect manufactures hermetic package lid in a variety of configurations including: stepped/flat lids, solder seal lids, domed/can lids, and window lids. Metal options include ASTM-F15 alloys (Kovar, 42, 46, 48, and 49) to 300/400 Series stainless steel, to cold rolled steel while window material options include borosilicate and sapphire, depending on the specific customer requirements.
As electronics in optical communications applications become more dense and complex, the ability to efficiently remove heat from a component's internal environment becomes a key consideration to ensure reliable, long-term operation. Qnnect has decades of experience in manufacturing thermal management components such as thermal tabs and base plates that allow our customers to mitigate risk related to excessive heat build-up. Our expertise in metallurgy and the manufacture of metals and metal alloys means we can provide a range of material options to meet a wide variety of thermal management challenges.
Preforms from Qnnect are excellent solution for attaching electronic circuitry and packaging electronic devices as they deliver good thermal and electrical conductivity as well as provide an interface for electronic connections. Extensive tooling supporting common shapes is available, we also offer complex geometries using low-cost tooling options.
Our fiber optic and telecom packaging solutions ensure the electronics within those devices are unaffected by whatever extreme environmental condition they operate in. Housing material options include: titanium, aluminum, Kovar, Invar and 42/46/49 alloys. Integrated connector options include: SMA, SSMA, OSP, OSSP interfaces and a range of DC connector configurations.
We offer innovative solutions and produce state-of-the-art products for defense & aerospace, energy, industrial, medical and optical networking industries.
We’re not just a manufacturer; we offer our customers value added services to help them succeed when in-house capacity is not an option.