Engineering Brief: DiaCool for High Density Power Applications

DiaCool for High Power Density Applications

Electronic circuits and components are being designed to handle greater amounts of power in smaller packages. The amount of power used or transmitted per unit mass, area or volume is often referred to as the “power density.” Higher power density […]

Make Your Gimble More Nimble

Military and civilian aerospace products feature highly sophisticated electronic systems that are completely reliant on the robust transmission of electrical power and signals. To make the engineering challenge tougher, many of these systems service components that need to move relative […]

Improve Quality & Reduce Manufacturing Costs with Solder Preforms

Improve Quality & Reduce Manufacturing Costs with Solder Preforms The use of solder preforms can significantly simplify the effective attachment of components to an electronic package, reducing assembly time and subsequent costs while increasing reliability. Preforms are designed to deliver […]