First featured & presented by Hua Xia at HiTEN in 2019, our paper on Moisture-resistant sealing materials for downhole HPHT electrical feedthrough packages has been published in two IMAPS Journals:

1. Journal of Microelectronics and Electronic Packaging: https://lnkd.in/e374ucS
2. International Symposium on Microelectronics: https://lnkd.in/eQpRDnM

You can also download the full whitepaper & read more about Kryoflex & Kryoflex XTS here: http://bit.ly/2GDkESr

For additional details, please contact Dave DeWire at ddewire@hermeticsolutions.com.