Lead-Free Solder Preform Option from Hermetic Solutions Group
TREVOSE, PA – December 3, 2019 – Hermetic Solutions Group’s Alloys Division now offers SAC305 solder preforms manufactured for applications that require an alternative to traditional tin-lead solders. This tin-silver-copper alloy is manufactured by the Hermetic Solution Group and contains 3.0% silver, 0.5% copper with tin comprising the remaining 96.5% of the formula.
This material is ideal for solder preform applications that require RoHS compliance. Lead free SAC alloys are also less subject to fatigue related to thermal cycling and are more resistant to gold embrittlement than tin-lead alternatives.
For additional details, please contact Dave DeWire at firstname.lastname@example.org